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The Infrared Reflow Oven Furnace is a highly efficient and user-friendly solution for soldering SMD and BGA components. Controlled by a microcomputer, it offers eight pre-set reflow temperature control curves to meet various soldering requirements. With its automatic operation, it simplifies the entire soldering process and ensures precise results. Fast infrared radiation and circulating wind heating technology guarantee accurate and uniform temperature distribution. The fuzzy temperature control technology and visual drawer-style workbench allow for supervision and control throughout the welding process. This versatile oven can handle single and double-sided boards, making it suitable for a wide range of applications. Designed with maintenance-free and highly reliable features, this oven provides peace of mind and long-lasting performance.
Technical Parameters
Effective Welding Area: 18 x 23.5 cm / 7in x9.25
Product Dimensions: 31 x 29 x 17 cm/ 12.2 x 11.4 x6.7in
Product Packaging Size: 36 x 23 x 36 cm / 14 x 9 x 14in
Rated Power: 800W
Process Cycle: 1-8 minutes
Power Supply Voltage: AC 110V (220V optional)/50-60Hz
Powerful and Versatile: The Infrared Reflow Oven Furnace is the ultimate solution for efficient and precise soldering. With its 800W power and spacious soldering area, soldering oven can handle various encapsulation forms for single and double PCB panels.With its impressive 800W power and a spacious soldering area of 180 x 235 mm
Automatic Control: This hot air reflow soldering machine is fully controlled by a microcomputer, allowing for hassle-free operation and reliable results. It automatically handles the entire soldering process, from preheating to cooling
Precise and Efficient: With a temperature range of 0℃ – 280℃ and a cycle time of 1-8 minutes, this soldering hot plate provides precise and efficient soldering. The fast infrared heating and uniform temperature distribution ensure high-quality solder joints
Memory Function and Forced Heating/Cooling: Store up to eight temperature parameter waves in the memory and choose the optimal settings for your soldering needs. The forced heating and cooling function enhances efficiency and flexibility
Multifunctional: This desktop reflow oven integrates various functions such as reflow soldering, drying, insulation, shaping, and rapid cooling. It can handle different packaging forms and is suitable for a wide range of applications. It can handle different packaging forms, including CHIP, SOP, PLCC, QFP, BGA
Version 2.0: T962 has been upgraded to version 2.0, adding some additional features, as follows: The 2.0 series can be connected to a computer to change the temperature curve (or used without a computer), with a constant temperature timer function (The product does not include a connecting cable and needs to be purchased by oneself)
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